Challenge 9 : Full-Chip Floorplan
Hi All, check below Challenge to revise your concepts related to Floorplan. Consider one FullChip with below specification: core-to-die : 1.014 Floorplan Shape : Rectangle Max routing layers : M15 site row height : 0.169 site row width : 0.048 FinFET grid (Y) : 0.026 FinFET grid (X) : 0.0005 M5 track offset : 0.026 Consider one block from FullChip from below specification: Block level ports in M5 layers (Horizontal direction) , M5 Pitch : 0.076 M5 track offset : 0.026 Floorplan Shape : Rectangle Max routing layers : M13 site row height : 0.169 site row width : 0.048 FinFET grid (Y) : 0.026 FinFET grid (X) : 0.0005 core-to-die : 1.014 Goal: Block-A and Block B is same. (instantiated two times in FullChip) in FullChip, Both blocks orientation is R0. In FullChip, two block (Block-A and Block-B) need to be placed as vertically stacked. ( i.e. 0 Y distance between two blocks) There shouldn't be FEOL/base drc violations and Ports of both blocks should be on track. Comment How to archive...